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PCI Express x4, Gen3 XMC Carrier Meets Embedded I/O Needs

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TEWS Technologies has added PCI Express carriers to its product portfolio. The TPCE278 is a standard height PCI Express Revision 3.0 compatible module that provides one slot for a single-width XMC module. It provides a versatile way to upgrade well known XMC I/O solutions to the PCI Express signaling standard used to build modular, flexible and cost effective I/O solutions for all kinds of applications. The PCI Express x4 link from the host board to the XMC module is enhanced by a PCIe Gen3 Redriver, allowing safe operation of XMC modules on PCIe mainboards.

The TPCE278 supports XMC front panel I/O, and also P14 and P16 rear I/O independently.

XMC P14 rear I/O is provided through a Tyco AMPMODU System 50 0.050x0.100 flat ribbon cable connector. The I/O lines are routed differential. XMC P16 rear I/O is implemented through two Samtec QTH-DP 0.50mm Q Pairs High Speed Ground Plane Socket Strip, Differential Pair connector providing access to all P16 I/O lines. The PCIe edge card connector provides +12V and +3.3V. The TPCE278 uses the +12V of the PCIe edge card connector to generate all power supply voltages for the XMC slot (+3.3V, VPWR and +12V).

For increased power requirements of an XMC module, TEWS offers TPCE278 variants with a PCIe Graphics Power Connector to supply the +12V for generating all the power supply voltages for the XMC slot providing power of up to 75W. A 10-pin JTAG header is available for XMC module debugging purposes. All five JTAG signals are routed directly to the XMC slot. Designed for demanding environments, the TPCE278 operates from -40 to +85 degrees C.

TEWS Technologies
Reno, NV
(775) 850-5830
www.tews.com

 

 

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