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Data Sheet COM Express Boards Roundup

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Figure 1

Figure 1
Abaco Systems

Type 10 COM Express Module Sports NVIDIA Tegra K1 SoC

Based on the NVIDIA Tegra K1 system-on-chip (SoC), Abaco Systems' Mini COM Express module delivers 326 Gflops of performance in a 10 Watt budget, well beyond the performance typically associated with COM Express, to SWaP-constrained environments. The mCOM10K1's on-board components are specifically selected for their reliability in demanding conditions. Unlike solutions designed for benign environments, the processor and memory are soldered to the board for maximum resistance to shock and vibration.

  • COM Express mini, Type 10 form factor.
  • NVIDIA Tegra K1 SoC.
  • Up to 2 GB DDR3L SDRAM memory.
  • Audio, Gbit Ethernet, GPIO, HDMI or DV1, SATA and Serial USB.
  • Suited for rugged, video and graphics applications.
  • Air cooling and conduction cooling available.
  • Conformal coating optional.

mCOM10K1 Data Sheet:  Click Here

Abaco Systems
Huntsville, AL
(866) 652-2226
www.abaco.com

 

Figure 2

Figure 2
Acromag

Type 6 COM Express Core i7 Card Features Programmable Power

Acromag's XCOM-6400 is a basic size platform (95 x 125mm) processor module with Type 6 interconnects. Several models are available with the 4th generation (Haswell) Intel Core i7 or i5 CPUs. Programmable power limit feature allows user to "dial-down" the maximum power consumption of the CPU in systems where power is a concern.

  • Intel 4th Gen (Haswell) Core i7 or Core i5.
  • Programmable CPU power.
  • Intel 8-Series QM87 PCH chipset
  • Up to 16 GB of DDR3L DRAM.
  • Advanced heat management technologies.
  • Up to -25 to 85 degrees C operating range.
  • 7 ports of PCIe x1, SPI bus, LPC bus, SMBus, I2C.
  • VGA Interface, 3x Digital Display Interface, eDP Interface (x2), HDA Audio Interface.
  • Gbit Ethernet Media Dependent Interface (MDI), 8 USB ports, 4 SATA III Ports, 4 GP I/O.

XCOM-6400 Data Sheet:  Click Here

Acromag
Wixom, MI
(248) 624-1541
www.acromag.com

 

Figure 3

Figure 3
ADLINK Technology

16-Core Xeon-D SoC Rides COM Express Type 7 Board

The Express-BD7 is ADLINK's first computer-on-module based on the latest PICMG COM Express 3.0 specification with new Type 7 pinout. The COM Express standard's new Type 7 pinout, as compared to the Type 6 pinout, does away with all graphics support and replaces it with up to four 10GbE ports and an additional eight PCIe ports, bringing the total PCIe support to up to 32 PCIe lanes. The Express-BD7 targets customers building space-constrained systems that require high density CPU cores balanced by reasonable power consumption.

  • Up to 16 cores Intel Xeon D Series SoC (formerly codename: Broadwell-DE).
  • Up to 32 Gbytes of dual channel DDR4 with ECC.
  • Two 10G Ethernet and NC-SI support.
  • Up to eight PCIe x1 (Gen2), one PCIe x16 (Gen3); GbE, two SATA 6 Gbits/s, four USB 3.0/2.0.
  • Supports Smart Embedded Management Agent (SEMA) functions.
  • Extreme Rugged operating temperature: -40 to +85 degrees C.

Express-BD7 Data Sheet:  Click Here

ADLINK Technology
San Jose, CA
(408) 360-0200
www.adlinktech.com

 

Figure 4

Figure 4
Advantech

COM Express Basic Module Serves up Xeon-D-1500 Processor

Advantech's SOM-5991 is a COM Express Basic Module designed around the Intel Xeon Processor D-1500 family. This COM Express powered by a server-grade processor that boasts up to 16-core scalability; with integrated 10GBase-KR, it provides high bandwidth interfaces for data transmission-reception, and all within a basic form-factor of 125 x 95 mm with a Type 6 compliant pin-out. The computing capability and low thermal design power deliver better power efficiency and make it very suitable for microservers, networking, and cloud storage.

  • Intel Xeon Processor D-1500 Product Family.
  • COM Express R2.1 Basic Module Type 6 pin out compatible.
  • Up to 16 core with TDP 45W.
  • Dual DDR4 2400, 1.2V Low Power Memory, up to 32 Gbytes.
  • PCIe x16, 8 PCIe x1, 2 x 10GBASE-KR interface.
  • Supports iManager, SUSIAccess and Embedded Software APIs.

SOM-5991 Data Sheet:  Click Here

Advantech
Irvine, CA
(949) 519-3800
www.advantech.com

 

Figure 5

Figure 5
American Portwell

Xeon-D COM Express Card Features 48 Gbytes of DDR-2133 SDRAM

American Portwell's PCOM-B634VG is designed with Intel Xeon Processor D Product Family with 8 CPU cores, 10GbE Ethernet supporting KR and KX4 interfaces, and up to 48 Gbytes of DDR4 ECC SDRAM, delivering powerful computing and excellent Ethernet performance. Gen3 PCIe x16 feature supports high-speed I/O card for extensive applications. With VGA and legacy interface support, customer can upgrade system easily and fast.

  • Intel Xeon Processor D Product Family (codename Broadwell DE).
  • Basic Form Factor COM Express Module.
  • Up to 48 Gbytes of DDR4-2133 ECC SDRAM on three SODIMM slots.
  • Supports VGA, HDMI and 10GbE interface.
  • 4x SATA3, 4x USB 3.0, 7x USB 2.0.
  • 1x Gen3 PCIe x16 and 8x Gen2 PCIe x1.
  • Operating Temperature: 0 to 60 degrees C (optional -40 to 85 degrees C).

PCOM-B634VG Data Sheet:  Click Here 

American Portwell
Fremont, CA
(510) 403-3399
www.portwell.com

 

Figure 6

Figure 6
Congatec

COM Express Compact Module Has 15W Celeron Processor

Congatec's COM Express Compact module conga-TC170 features the 2GHz dual-core Intel Celeron Processor 3955U with a configurable Thermal Design Power (cTDP) of 10-15W, which facilitates adapting the application to the energy concept of the system. The processor is based on the latest Intel 14nm microarchitecture (formerly codename Skylake). The module combines cost efficient dual-core CPU performance with state of the art features such as 4k multiscreen support, high-speed DDR4 RAM with increased bandwidth and four USB 3.0 ports.

  • Intel Celeron 3955U (2 x 2.0 GHz, 2 M Cache, 15W).
  • Intel Gen9 HD Graphics with HEVC (H.265) support.
  • Up to 32 Gbytes of Dual-Channel DDR4 memory.
  • 5 x PCI Express, 4 x USB 3.0 (XHCI), 8 x USB 2.0 (EHCI). 3 x SATA III.
  • LPC bus, I²C bus, 2 x UART.
  • Digital High Definition Audio Interface.
  • High performance hardware MPEG-2 decoding support.
  • Operating temperature 0 to +60 degrees C.

conga-TC170 Data Sheet:  Click Here 

Congatec
San Diego, CA
(858) 457-2600
www.congatec.com

 

Figure 7

Figure 7
Extreme Engineering

COM Express Module Serves up NXP QorIQ T4240 Processor

The XPedite5850 from Extreme Engineering Solutions is a ruggedized COM Express module that complies with the COM Express Basic form factor (95 mm x 125 mm) and supports an enhanced Type 5-based pinout. COM Express provides a standards-based form factor to bring processing to a wide range of applications. Available in both conduction- and air-cooled versions, the XPedite5850 supports the NXP (formerly Freescale) QorIQ T4 processors.

  • NXP QorIQ T4240 processor with 12 dual-threaded Power Architecture e6500 cores at up to 1.667 GHz.
  • COM Express Basic form factor (95 mm x 125 mm).
  • Conduction- or air-cooled; Extended shock and vibration tolerance.
  • Up to 16 Gbytes of up to DDR3-1866 ECC SDRAM in two channels.
  • x4 and x8 PCI Express interfaces, 4 Ten Gbit Ethernet ports, 8 Gbit Ethernet ports, 2 serial ports, 2 USB 2.0 ports, 2 SATA ports.

XPedite5850 Data Sheet:  Click Here

Extreme Engineering Solutions
Middleton, WI
(608) 833-1155
www.xes-inc.com

 

Figure 8

Figure 8
Kontron

COM Express Core and Xeon Modules Feature Embedded Security

The COMe-bSL6 (shown) and COMe-bSL6R E2S from Kontron are COM-modules based on the COM Express Basic standard form factor (125 x 95mm) and Intel 6th Generation Core /  Xeon E3 v5 Family processors. Integrated high performance Intel HD Graphics or Intel Iris Pro Graphics with 128M of on-package cache memory, can support three independent displays with up to 4K resolution. The modules are equipped with Kontron's standard hardware-based embedded Security Solution Approtect.

  • Intel 6th Generation Core series / Xeon E3 v5 family with CM236/QM170 PCH.
  • COM Express Basic, Pin-out Type 6.
  • 2x DDR4-2133 SO-DIMM up to 2x 16 Gbytes (non-ECC/ECC).
  • Rapid Shutdown offers an extremely fast shutdown to minimize data tampering.
  • 4 SATA3 6 Gbit/s interfaces.
  • 4x USB 3.0; 4x USB 2.0, 1x USB Client, 6x USB 2.0 and 8x PCIe x1.

COMe-bSL6 Data Sheet:  Click Here

Kontron
Poway, CA
(888) 294-4558
www.kontron.com

 

Figure 9

Figure 9
MSC Technologies

Type 6 Compact COMe Board Sports 5W Quad-Core Atom Processor

MSC Technologies' MSC C6C-BW module family based on Intel's current Atom processor platform (codenamed "Braswell") has got a new member based on the Intel Atom x5-E8000. This quad-core processor has an extremely low power dissipation of maximum 5 W. It operates at a nominal clock rate of 1.04 GHz and can achieve 2.0 GHz in burst mode.

  • Intel Atom x5-E8000 quad-core 1.04/2.0GHz, 2MB Cache, 5W TDP.
  • Integrated Intel HD graphics Gen. 8.
  • Up to 8 Gbytes of DDR3L (1333), 2x 204 pin SO-DIMM.
  • Two SATA 6 Gbit/s mass storage interfaces.
  • Two DisplayPort/HDMI/DVI interfaces; 1x Embedded DisplayPort interface.
  • LVDS and CRT interface.
  • Optional hardware based security compliant to Trusted Computing Group.
  • 5 PCI Express x1 lanes. 4 USB 3.0 and 4 USB 2.0 interfaces.

MSC C6C-BW Data Sheet:  Click Here 

MSC Technologies
San Bruno, CA
(650) 616-4068
www.mscembedded.com

 

 

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